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ShenZhen Xunjiexing Electrontic Co.,Ltd

Showing 1 - 9 of 9, total 1 pages        [First] [Previous] [Next] [Last]

1
pcb with different copper weight
pcb with different copper weight
Specification: IPC-II
Detail: layer:16 innerlayer core:0.55 18/35 (different copper thickness in the same core,this is a very difficult point when making etching) smallest hole:0.20mm board thickness:1.66mm

2
high quality pcb(24 layer)
high quality pcb(24 layer)
Specification: IPC-II
Detail: Layer count:24 board thickness:3.0mm smallest holes:0.20mm aspect ratio:12.5:1 via holes to the inner layer track:7.8mil Treaatment: immersion gold Final dimension:230*300mm Track/gap in innerlayer:4/3.5mil

3
30 layer pcb
30 layer pcb
Specification: IPC-II
Detail: Layer count:30 board thickness:3.0mm smallest holes:0.20mm aspect ratio:12.5:1 via holes to the inner layer track:7.5mil BGA size:10mil Treaatment: immersion gold

4
pcb with different copper weight
pcb with different copper weight
Specification: IPC-II
Detail: layer:16 innerlayer core:0.55 18/35 (different copper thickness in the same core,this is a very difficult point when making etching) smallest hole:0.20mm board thickness:1.66mm

5
high quality pcb(24 layer)
high quality pcb(24 layer)
Specification: IPC-II
Detail: Layer count:24 board thickness:3.0mm smallest holes:0.20mm aspect ratio:12.5:1 via holes to the inner layer track:7.8mil Treaatment: immersion gold Final dimension:230*300mm Track/gap in innerlayer:4/3.5mil

6
30 layer pcb
30 layer pcb
Specification: IPC-II
Detail: Layer count:30 board thickness:3.0mm smallest holes:0.20mm aspect ratio:12.5:1 via holes to the inner layer track:7.5mil BGA size:10mil Treaatment: immersion gold

7
memory bank rigid pcb
memory bank rigid pcb
Specification: 100*100
Detail: layer count:4 treatment:immersion gold track/gap:4/4mil smallest hole:0.20mm board thinkness:1.0+/-0.1mm (this is a memory bank of a famous computer co***ny in China)

8
high quality rigid pcb
high quality rigid pcb
Specification: 200*100
Detail: Layer count:24 board thickness:3.0mm smallest holes:0.20mm aspect ratio:12.5:1 via holes to the inner layer track:7.8mil Treaatment: immersion gold Final dimension:230*300mm Track/gap in innerlayer:4/3.5mil

9
high precision rigid pcb(30 layer)
high precision rigid pcb(30 layer)
Specification: unit
Detail: Layer count:30 board thickness:3.0mm smallest holes:0.20mm aspect ratio:12.5:1 via holes to the inner layer track:7.5mil BGA size:10mil Treaatment: immersion gold
Showing 1 - 9 of 9, total 1 pages        [First] [Previous] [Next] [Last]
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